| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method capable of applying plating to a desired part even to a substrate worked into a complicated shape without giving damage or the like caused by heating. SOLUTION: Each resist layer 15 is formed on the whole surface of the longitudinal part 7 in a substrate 14 by electrodeposition coating, thereafter, the resist layer 15 formed on a low wettability region forming scheduled part 23 is exposed all around the periphery in the circumferential direction of the longitudinal part 7, and is developed, so as to form a resist pattern 16, and plating is applied to the part 22 not covered with the resist layer 15 in the longitudinal part 7 of the substrate 14. In this way, even to the substrate 14 worked into a complicated shape, or, even in the case the pitch T of the substrate 14 is the narrow one of about 0.1 mm, plating can be applied to the desired part in the longitudinal part 7 of the substrate 14 all around the periphery in the circumferential direction, thus a contact component such as a connector pin in which a low wettability region is formed between a solder joint and a connector insertion part can be easily produced. COPYRIGHT: (C)2006,JPO&NCIPI |
