| 摘要 |
PROBLEM TO BE SOLVED: To improve the mechanical strength of a cooling device for a semiconductor laser and the like and reduce the pressure loss of a cooling liquid. SOLUTION: The mechanical joint strength of a cooling device is improved by increasing a cross-section area and reducing the pressure loss of a cooling liquid. A flow path is formed comprising a groove 14 divided by ridges 13, 30 and 32, a projection 15 and 33, and a penetration 17 divided by separating bands 16, 18, 31, and 34 including an opening for supplying and draining the cooling liquid, in plate members 2 to 4 constituting a cooling device 1 and joining the ridge, the projection, and the separating band with the adjacent plate-type member. The ridge, the projection 15, and the separating band are formed on the same position on the different plate type member. The groove 14 and the penetrated portion 17 can be formed simultaneously with the outer shape of the plate type member by chemical etching. The plurality of plate type members are manufactured simultaneously of the same plate member. COPYRIGHT: (C)2006,JPO&NCIPI
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