| 摘要 |
The semiconductor device of the invention has a heat spreader 9 mounted on a semiconductor element 5 . The area of one surface of the heat spreader 9 closer to the semiconductor element 5 is generally equal to the area of one surface of the semiconductor element 5 closer to the heat spreader 9 . With this structure, manufacturing cost of the semiconductor device can be reduced and moreover its reliability can be enhanced.
|
