| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device wherein a bonding wire on a die pad is prevented from being disconnected by thermal stress and wire non-attaching upon bonding of both of the die pad, and an electrode pad, is unlikely to occur. SOLUTION: A groove 6 is provided between an end B of a semiconductor chip 2 on the die pad 1 and an end C of the bonding wire 3. It is hereby possible to prevent peeling occurring at the B between sealing resin 5 and the die pad 1 from advancing to the C, and hence to prevent the bonding wire 3 on the die pad 1 from being disconnected. COPYRIGHT: (C)2006,JPO&NCIPI
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