PRINTED CIRCUIT BOARD ARRANGEMENT

摘要

The present invention relates to a printed circuit board arrangement with a multi- layer substrate (1, 2) having a buried conductor (4) and a contact area (3), connected to the conductor (4) and being disposed on a surface of the substrate. In order to improve the cooling of the buried conductor, a metal cooling area (6) is provided above the conductor (4), and is connected to the conductor by means of one or more via conductors (7).