Semiconductor component comprising a surface metallization

摘要

The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body ( 3 ) and a package base body ( 2 ) on whose surface conductor path structures ( 7 ) are formed by means of surface metallization. A subregion of the conductor path structure ( 7 ) constitutes the solder connections of the semiconductor component. The solder connections ( 1 ) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.