发明名称 |
Method for retesting semiconductor device |
摘要 |
A method for re-testing semiconductor device includes following processes: (1) providing a first carrier for accommodating semiconductor devices which have been tested; (2) taking the semiconductor devices out from the first carrier and placing them according to the information of a fist map by a pick-and-place machine, wherein the information of the first map has the coordinates of the positions of the film frame where the semiconductor is to be placed; (3) placing the film frame with the semiconductor devices placed thereon to a testing machine, and re-testing the semiconductor devices according to the information of the first map by the tester; (4) placing the film frame with the semiconductor devices attached thereon to a pick-and-place machine, and taking the semiconductor devices out according to the result of the retesting from the film frame, and placing the semiconductor devices on at least one carriers.
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申请公布号 |
US7109740(B2) |
申请公布日期 |
2006.09.19 |
申请号 |
US20050167147 |
申请日期 |
2005.06.28 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHUAN CHIN-CHEN;LIN CHIU-CHENG;LEE CHENG CHIEH;HUANG KUEI LIN;CHEN YONG LIANG;WANG JUI LIANG;CHIEN PAO TA;KUNG HSIANG-HAN;HWU CHAO HSIUNG |
分类号 |
G01R31/26;G01R31/28;H01L21/66 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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