The method for Manufacturing of Circuit Board for Semiconductor Package,申请号KR20040026143-传众专利搜索

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发明名称	The method for Manufacturing of Circuit Board for Semiconductor Package
摘要
申请公布号	KR100623308(B1)	申请公布日期	2006.09.18
申请号	KR20040026143	申请日期	2004.04.16
申请人		发明人
分类号	H05K1/02	主分类号	H05K1/02
代理机构		代理人
主权项
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