Chemical mechanical polishing pad for polishing semiconductor substrates, comprises polymeric matrix formed of water-based polymer(s) and microspheres dispersed in polymer matrix

摘要

A chemical mechanical polishing pad (300) comprises a polymeric matrix having microspheres dispersed in it. The polymeric matrix is formed of water-based polymer(s). An independent claim is included for manufacture of chemical mechanical polishing pad which involves supplying a water-based fluid phase polymer composition containing microspheres onto a continuous transported backing layer (302), shaping the polymer composition on the backing layer into a fluid phase polishing layer (304) having preset thickness, and curing the polymer composition on the backing layer in a curing oven to convert the polymer composition to a solid phase polishing layer of the polishing pad.