发明名称 MANUFACTURING METHOD OF WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit board formed by adhering a wiring pattern to have a more fine wiring pattern shape. SOLUTION: The manufacturing method of wiring circuit board comprises the steps of forming an insulating layer on a first wiring formed on a core circuit board, transferring a second wiring to the relevant insulating layer by pressing the relevant second wiring formed on a supporting circuit board to the insulating layer, removing the relevant supporting circuit board, and forming a via plug for connecting the first wiring and the second wiring. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006245213(A) 申请公布日期 2006.09.14
申请号 JP20050057654 申请日期 2005.03.02
申请人 SHINKO ELECTRIC IND CO LTD 发明人 HIZUME TORU;TANAKA SHUICHI;MOCHIZUKI KENJI
分类号 H05K1/11;H05K3/20;H05K3/46 主分类号 H05K1/11
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