发明名称 |
MANUFACTURING METHOD OF WIRING CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board formed by adhering a wiring pattern to have a more fine wiring pattern shape. SOLUTION: The manufacturing method of wiring circuit board comprises the steps of forming an insulating layer on a first wiring formed on a core circuit board, transferring a second wiring to the relevant insulating layer by pressing the relevant second wiring formed on a supporting circuit board to the insulating layer, removing the relevant supporting circuit board, and forming a via plug for connecting the first wiring and the second wiring. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006245213(A) |
申请公布日期 |
2006.09.14 |
申请号 |
JP20050057654 |
申请日期 |
2005.03.02 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
HIZUME TORU;TANAKA SHUICHI;MOCHIZUKI KENJI |
分类号 |
H05K1/11;H05K3/20;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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