| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being easily executed and preventing the cracks of a resin sealing part even by heating in a reflow process or the like. <P>SOLUTION: In a semiconductor light emitting device 1 provided with a lead frame 4 for which a plating layer is formed on the surface of a substrate composed of a metal alloy, a semiconductor light emitting element 2 loaded on the lead frame 4a for loading and the resin sealing part 3 where the semiconductor light emitting element 2 is sealed with a resin, the lead frame 4a for loading is provided with a groove 6 so as to expose the substrate deeper than the plating layer from the position where the semiconductor light emitting element 2 is loaded to the position to be the outer side of the resin sealing part 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
