发明名称 POLYPROPYLENE-BASED RESIN COMPOSITION FOR EXPANSION MOLDING BY T DIE AND ITS EXPANSION MOLDING
摘要 PROBLEM TO BE SOLVED: To obtain a polypropylene-based resin composition for expansion molding, which has a low open-cell ratio in an addition system of an inorganic filler and has excellent expansion properties such as sheet appearance, etc., and its expansion molding. SOLUTION: The polypropylene-based resin composition for expansion molding by a T die comprises (A) 5-40 wt% of a polyolefin component having 5-30g melt tension at 230°C, (B) 5-90 wt% of a polypropylene-based resin satisfying (1) 1.5-7.0g melt tension at 190°C, (2) 3-10g/10 minutes melt flow rate, (3) the ratio of a weight-average molecular weight (Mw) to a number-average molecular weight (Mn) of 5-8 and 950,000-2,000,000 Z average molecular weight (Mz) and (4) 2-7 seconds relaxation time (τ) at an angular frequencyω=0.1rad/second in a melt viscoelasticity behavior measured by using a rotary rheometer and (C) 5-25 wt% of an inorganic filler. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006241356(A) 申请公布日期 2006.09.14
申请号 JP20050060671 申请日期 2005.03.04
申请人 PRIME POLYMER:KK 发明人 UMEDA TAKASHI;KONO TAKAYUKI;KATO KOJI;TANAKA YOSHIKATSU
分类号 C08J9/04;C08F4/655;C08F10/00;C08K3/34;C08L23/10 主分类号 C08J9/04
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