发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition not only excellent in performances such as sensitivity, insulating property and chemical resistance but in particular, significantly improved in transmittance and storage stability, and suitable for forming an interlayer insulating film in the process of manufacturing a LCD. <P>SOLUTION: The photosensitive resin composition comprises, in particular: (a) an acrylic copolymer obtained by copolymerizing (i) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride or a mixture of these, (ii) one or more kinds of epoxy group-containing unsaturated compounds selected from a group consisting of formula (1) to (8), and (iii) an olefin-based unsaturated compound, and then removing monomers not involved in the reaction; (b) a 1,2-quinonediazide compound; and (c) a solvent. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006243726(A) 申请公布日期 2006.09.14
申请号 JP20060051781 申请日期 2006.02.28
申请人 DONGJIN SEMICHEM CO LTD 发明人 YO TEFUN;KIM BYUNG-UK;JO YANYON;YUN HYOKUMIN;KUU KIHYOKU;YUN JUUPYO;JON UICHORU;KIM DONMYON;LEE HOJIN;CHE SANGAKU;SHIN HONDE;LEE DONHYOKU
分类号 G03F7/023;C08F220/32;C08F224/00;G03F7/004;G03F7/20;H01L21/027;H05K3/00 主分类号 G03F7/023
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