发明名称 CROSSLINKING LIGAND, METAL COMPLEX AND METAL COMPLEX INTEGRATED STRUCTURE
摘要 <p>A metal complex integrated structure that is suitable for use in the construction of nanoscale molecular devices with ultrahigh density and ultrahigh speed actuatability (molecular element, matrix circuit, molecular function device, logic circuit, etc.), and that is applicable to the miniaturization, precision promotion, etc. of various elements and devices of arithmetic unit, display, memory, etc. in the field of information communications; and a crosslinking ligand and metal complex suitable for use therein. There is provided a metal complex comprising a linear molecule with p-conjugated skeleton exhibiting at least either a donor or an acceptor property and, possessed at each of both ends thereof, a substituent containing two chalcogen atoms capable of coordinate bonding with metals. Further, there is provided a metal complex comprising at least a metal ion pair composed of two metal ions and, coordinating with the metal ion pair, a crosslinking ligand. Still further, there is provided a metal complex integrated structure comprising a metal complex as mentioned above and, coupled with the metal ions of metal ion pair thereof, a linking ligand.</p>
申请公布号 WO2006095435(A1) 申请公布日期 2006.09.14
申请号 WO2005JP04257 申请日期 2005.03.10
申请人 FUJITSU LIMITED;MANABE, TOSHIO;TAKEI, FUMIO 发明人 MANABE, TOSHIO;TAKEI, FUMIO
分类号 (IPC1-7):C07D213/22;C07F15/00;C07F15/04;H01L51/00;C07D241/10 主分类号 (IPC1-7):C07D213/22
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