SEMICONDUCTOR PACKAGE INCLUDING SOLDER FOR PACKAGING,申请号KR20050018428-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE INCLUDING SOLDER FOR PACKAGING
摘要
申请公布号	KR20060097308(A)	申请公布日期	2006.09.14
申请号	KR20050018428	申请日期	2005.03.05
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	LIM, GWANG MAN;LEE, JONG HO
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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