发明名称 |
Preparation of semiconductor device |
摘要 |
In the preparation of a semiconductor device comprising a semiconductor member, the semiconductor member is subjected to plasma treatment and then primer treatment, prior to the encapsulation thereof with an encapsulant. The semiconductor device, typically LED package, is highly reliable in that a firm bond is established between the semiconductor member and the encapsulant resin.
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申请公布号 |
US2006205237(A1) |
申请公布日期 |
2006.09.14 |
申请号 |
US20060360413 |
申请日期 |
2006.02.24 |
申请人 |
SHIN-ETSU CHEMICAL CO, LTD. |
发明人 |
KODAMA KINYA;KASHIWAGI TSUTOMU;IMAZAWA KATSUYUKI |
分类号 |
H01L21/31;H01L33/56;H01L21/469 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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