发明名称 Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry
摘要 A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a relevant module for purification of a semiconductor polishing slurry; and a process for purifying a semiconductor polishing slurry with the use thereof. In particular, a material for purification of a semiconductor polishing slurry characterized in that it comprises a fibrous substrate having a functional group capable of forming a metal chelate or such a functional group together with hydroxyl fixed onto at least the surface thereof. This material for purification of a semiconductor polishing slurry is, for example, used in such a manner that it is inserted in a container fitted with polishing slurry inflow port and outflow port while ensuring passage of polishing slurry flow.
申请公布号 US2006205325(A1) 申请公布日期 2006.09.14
申请号 US20050549294 申请日期 2005.09.16
申请人 NOMURA MICRO SCIENCE CO., LTD. 发明人 ABE MITSUGU;NAMBU NOBUYOSHI;ITO OSAMU;OGITSU MASAAKI;INOMATA KAZUO
分类号 B24B1/00;B01J45/00;B01J47/04;B01J47/10;B01J47/12;B01J47/14;B24B37/00;B24B57/02;C02F11/00;C23F1/46;H01L21/304 主分类号 B24B1/00
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