METHOD FOR PROCESSING ELECTRODE OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To effectively utilize a cutting tool and to prolong lifetime thereof by suppressing partial abrasion of the cutting tool to approximately uniform abrasion condition when the head of a bump of the surface of a semiconductor wafer is chipped off by the cutting tool such as a cutter to uniform the height. SOLUTION: The semiconductor wafer W held on a chuck table 17 in such a state that it is not rotated is sent to a cutting unit 20 in which the cutter 26 rotates, and made to reciprocate to make the cutter 26 act to the semiconductor wafer W in both the processes of sending on an approach route (a first cutting process) and that on a return route (a second cutting process). Thereby the process of abrasion of left and right cutting edges 28a and 28b in a cutting part 28 of the cutter 26 is equalized. COPYRIGHT: (C)2006,JPO&NCIPI