| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure which is superior in heat dissipation, thermal change, electrical characterisitic, and adhesion to a semiconductor element or the like, and to provide a semiconductor element heat dissipation member and a semiconductor. SOLUTION: The structure is provided with a heat sink (metal substrate) 10 having thermal conductivity, a DLC film (insulating amorphous carbon film) 12 covering at least part of the surface of the metal substrate 10, and a laminated electrode 16 that is formed on the DLC film 12 and is formed of three layers. The semiconductor element heat dissipation member and the semiconductor device use the structure. COPYRIGHT: (C)2006,JPO&NCIPI |
