发明名称 POLYESTER FILM FOR MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a polyester film for molding that is excellent in moldability at a low temperature under a low pressure as well as in solvent resistance and heat resistance, has a light environmental load, exhibits excellent electrostatic adhesion and contains little amount of foreign matter. SOLUTION: The polyester film for molding is composed of a biaxially oriented polyester film constituted of a copolyester and containing an alkaline earth metal compound (M) and a phosphorus compound (P) so that the content of M is 0.05-0.40 mol% and that the M/P molar ratio is 1.0-3.5, and has a stress at 100% elongation of 10-1,000 MPa at 25°C and 1-100 MPa at 100°C in each of the longitudinal direction and the width direction of the film, a storage viscoelastic modulus (E') of 10-1,000 MPa at 100°C and 5-40 MPa at 180°C in each of the longitudinal direction and the width direction of the film, and a heat distortion rate (in the longitudinal direction of the film) under a weak tension of -3 to +3% at 175°C. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006241311(A) 申请公布日期 2006.09.14
申请号 JP20050059088 申请日期 2005.03.03
申请人 TOYOBO CO LTD 发明人 KUMANO KATSUFUMI;HARAGUCHI HIROKI;SASAKI YASUSHI;HIGASHIURA MASAYA
分类号 C08J5/18;B29C55/12;B29K67/00;B29L7/00;C08L67/00 主分类号 C08J5/18
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