发明名称 GOLD-NICKEL BASED AMORPHOUS ALLOY PLATING FILM, ELECTROPLATING LIQUID AND ELECTROPLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a gold-nickel based amorphous alloy plating film formed of a homogeneous amorphous phase free from fine crystals, and whose hardness is improved while maintaining the satisfactory contact resistance value and chemical stability characteristic of gold to degrees practically free from problems, thus which is useful as the contact material for electrical/electronic parts such as a relay. SOLUTION: The gold-nickel based amorphous alloy plating film is formed of a homogeneous amorphous phase free from fine crystallites. The electroplating liquid comprises a gold cyanide salt in the concentration of 0.01 to 0.1 mol/dm<SP>3</SP>in terms of gold, a nickel salt in the concentration of 0.02 to 0.2 mol/dm<SP>3</SP>in terms of nickel, and a tungstate in the concentration of 0.1 to 0.5 mol/dm<SP>3</SP>in terms of tungsten. In the electroplating method, the gold-nickel based amorphous alloy plating film is formed using the electroplating liquid. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006241594(A) 申请公布日期 2006.09.14
申请号 JP20060024476 申请日期 2006.02.01
申请人 UNIV WASEDA;KANTO CHEM CO INC 发明人 OKINAKA YUTAKA;HONMA NORIYUKI;AISAKA TETSUYA
分类号 C25D3/62;C25D7/00 主分类号 C25D3/62
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