| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal printed head of a structure, wherein while the thickness of electrode layers is made thin, the bonding strength of a wire bonding of the electrode layers to a driving IC can be increased. SOLUTION: This head is a thermal printed head of a structure, wherein the thermal printed head is provided with a substrate 1, a glazed layer 2 formed on the upper surface of the substrate 1, indivisual electrode layers 4 formed on the upper surface of the layer 2, a heating resistor which is formed on the upper surfaces of the layers 4 and generates heat by applying a current to the resistor through the layers 4, and a driving IC 9 which is formed on the upper surface of the layer 2 and controls a current conduction to the resistor 7. The layers 4 and the IC 9 are connected with each other by a wire bonding, and in the bonding parts on the sides of the layers 4, metal layers 121 for ensuring the adhesion of the layers 4 to the layer 2 are made to interpose between the layer 2 and the layers 4. |
