发明名称 Negative resist composition comprising hydroxy-substituted base polymer and si-containing crosslinker having epoxy ring and a method for patterning semiconductor devices using the same
摘要 A negative resist composition and a method for patterning semiconductor devices using the composition are provided. The negative resist composition contains an alkali-soluble hydroxy-substituted base polymer, a silicon-containing crosslinker having an epoxy ring, and a photoacid generator. In the method for patterning semiconductor devices, fine patterns are formed according to a bi-layer resist process using the negative resist composition.
申请公布号 US7105271(B2) 申请公布日期 2006.09.12
申请号 US20030400097 申请日期 2003.03.26
申请人 SAMSUNG ELECTRONICS, CO., LTD 发明人 CHOI SANG-JUN
分类号 G03F7/038;G03F7/075;C08G59/40;G03F7/004;G03F7/095;G03F7/40;H01L21/027 主分类号 G03F7/038
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