发明名称 |
Negative resist composition comprising hydroxy-substituted base polymer and si-containing crosslinker having epoxy ring and a method for patterning semiconductor devices using the same |
摘要 |
A negative resist composition and a method for patterning semiconductor devices using the composition are provided. The negative resist composition contains an alkali-soluble hydroxy-substituted base polymer, a silicon-containing crosslinker having an epoxy ring, and a photoacid generator. In the method for patterning semiconductor devices, fine patterns are formed according to a bi-layer resist process using the negative resist composition.
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申请公布号 |
US7105271(B2) |
申请公布日期 |
2006.09.12 |
申请号 |
US20030400097 |
申请日期 |
2003.03.26 |
申请人 |
SAMSUNG ELECTRONICS, CO., LTD |
发明人 |
CHOI SANG-JUN |
分类号 |
G03F7/038;G03F7/075;C08G59/40;G03F7/004;G03F7/095;G03F7/40;H01L21/027 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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