THROUGH ELECTRODE AND MANUFACTURING METHOD THEREFOR, PACKAGING BASE MOUNT HAVING THE SAME AND SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To secure bonding strength with an external terminal or a vamp of a through electrode to be provided on a packaging substrate or a chip substrate, and to provide a means to shorten the time to embed conductors for the through electrode.

SOLUTION: A through electrode passes the front surface of a silicon substrate to the back surface, thus making its front and back surfaces electrically conductive. A plurality of fine through holes that go through from the front surface to the back surface and conductors embedded in the fine through holes are provided in the through electrode formation area of the silicon substrate, and the plurality of conductors are electrically connected.

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