发明名称 |
Image sensor and methods of forming the same |
摘要 |
A method of forming an image sensor is provided. The method includes forming a protection insulating layer, a lower mold insulating layer and an upper mold insulating layer over a semiconductor substrate in which a plurality of photodiodes are spaced apart from one another. The method further includes forming a dummy pattern contact with the lower mold insulating layer in the upper mold insulating layer, forming a preliminary cavity exposing the lower mold insulating layer contact with the dummy pattern by selectively removing the dummy pattern, and forming a cavity exposing the protection insulating layer over the photodiode by anisotropically etching the exposed lower mold insulating layer.
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申请公布号 |
US2006199295(A1) |
申请公布日期 |
2006.09.07 |
申请号 |
US20060369474 |
申请日期 |
2006.03.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HONG JONG-WOOK;LEE JUNE-TAEG |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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