发明名称 Image sensor and methods of forming the same
摘要 A method of forming an image sensor is provided. The method includes forming a protection insulating layer, a lower mold insulating layer and an upper mold insulating layer over a semiconductor substrate in which a plurality of photodiodes are spaced apart from one another. The method further includes forming a dummy pattern contact with the lower mold insulating layer in the upper mold insulating layer, forming a preliminary cavity exposing the lower mold insulating layer contact with the dummy pattern by selectively removing the dummy pattern, and forming a cavity exposing the protection insulating layer over the photodiode by anisotropically etching the exposed lower mold insulating layer.
申请公布号 US2006199295(A1) 申请公布日期 2006.09.07
申请号 US20060369474 申请日期 2006.03.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG JONG-WOOK;LEE JUNE-TAEG
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
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