| 摘要 |
In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7 a that is formed by exposing a wire lead section 7 , which is electrically connected with an electrode of the chip through a bonding wire 4 , out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10 a that is formed by exposing a chip lead section 10 , which is partially covered with the chip, from the resin base.
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