| 摘要 |
This present invention related to a heatsink structure, used to dissipate heat from heat source component, comprises a heat conduction member, a heat transfer member and heatsink fins. Wherein the heat conduction member comprises a thermal pad and a clip; and the thermal pad, one of the sides connected with the heat source component, having at least one buckle pillar and one screw pillar. The heat transfer member, one side connected with the thermal pad in heat conductive manner. The heatsink fins connected with the other side of heat transfer member. The present invention uses the buckle pillar and screw pillar of the thermal pad to support the clip. The clip, connected with the buckle pillar and the screw pillar, can fix the heat source component and enable the surface heat generated from the heat source component connected with a thermal pad in heat conductive manner.
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