Substrate holding apparatus and polishing apparatus

摘要

The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member ( 6 ), and an elastic member ( 7 ) for defining a chamber ( 22 ). The elastic member ( 7 ) comprises a contact portion ( 8 ) which is brought into contact with the substrate (W), and a circumferential wall ( 9 ) extending upwardly from the contact portion ( 8 ) and connected to the vertically movable member ( 6 ). The circumferential wall ( 9 ) has a stretchable and contractible portion ( 40 ) which is stretchable and contractible vertically.