| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency module which suppresses the occurrence of projections/recessions in a via conductor on a multi-layer ceramic board obtained by calcination with a contracting characteristic in an X-Y axial direction suppressed therein, can form a flat surface, and is excellent in reliability to mount and seal a SAW chip. <P>SOLUTION: The high frequency module is obtained by mounting a surface acoustic wave element on the surface of the multi-layer ceramic board which is obtained by laminating a plurality of insulation layers. At least the ground electrodes or input/output electrodes of the insulation board are electrically connected to a prescribed conductive pattern which is formed on the rear surface of the insulation board by way of the plurality of via conductors including the via conductors directly connected to the electrodes. The via conductors other than the via conductors directly connected to the input/output electrodes and ring shape ground electrodes among the plurality of via conductors are arranged to be outer sides compared with the ring shape electrodes in a plane view. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
