| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer printed wiring board using a build-up method which can highly accurately aligning blind via holes on an external layer and a bottom lands on an internal layer. SOLUTION: In the method of manufacturing a multilayer printed wiring board, an insulating film 11 and a conductor layer consisting of copper foils 12a, 12b and a conductive coating 5 are laminated on an internal layer core substrate 3, and wiring patterns or blind via holes 16 are formed on the insulating layer 11 and the conductor layer using alignment marks 9 as a reference. In this method, the alignment marks 9 are coated with a film-like member 10 in advance before laminating the insulating layer 11, notch grooves 13 piercing from the external surface to the film-like member 10 are processed by laser after laminating the conductor layer, the insulating layer 11 and the conductor layer are eliminated together with the film-like member 10. COPYRIGHT: (C)2006,JPO&NCIPI |
