| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of fabricating a semiconductor device with requested characteristics in high yield at low cost without making processes and devices complex. <P>SOLUTION: The semiconductor has a thin film circuit provided on a substrate, and a conductive layer which is electrically connected to the thin film circuit and provided continuously on the substrate and thin film circuit. As an embodiment of a method for manufacturing the semiconductor device, the thin film circuit is installed on the substrate, and a composition containing a conductive material having flowability is stuck on the substrate and thin film circuit to form the conductive layer electrically connected to the thin film circuit. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
