| 摘要 |
The present invention relates to an electronic subassembly having a conductive layer, a conductive film and a method of making the same. The conductive film includes a supporting layer ( 31 ), a conductive layer ( 32 ) and a connection layer ( 33 ), all of which are orderly stacked. The connection layer ( 33 ) is formed on the conductive layer ( 32 ) and attaches the conductive film to the electronic subassembly. The supporting layer ( 31 ) will be peeled off after the conductive film adheres to the electronic subassembly. Thus, both two sides of the conductive layer ( 32 ) can be electrically connected to a ground circuit of the electronic subassembly, and the electronic subassembly has good electromagnetic shielding performance. Because the supporting layer ( 31 ) will be peeled off after the conductive film adheres to the electronic subassembly, there remains only the connection layer ( 33 ) and the conductive layer ( 32 ) on the electronic subassembly, the thickness of the electronic subassembly with the conductive film thereon is reduced.
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