| 摘要 |
An image sensor structure includes a substrate, a photosensitive chip, a plurality wires, a plurality of ball elements, a transparent layer, and a glue layer. The substrate has an upper surface and a lower surface. The photosensitive chip has a plurality of bonding pads, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the photosensitive chip to the substrate. The plurality of ball elements is located on the bonding pads of the photosensitive chip. The transparent layer is mounted on the ball elements to encapsulate the photosensitive chip. The glue layer is surrounded on the periphery of the upper surface of the substrate for encapsulating the wires, and is fixed the transparent layer.
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