| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which can be appropriately made thin. <P>SOLUTION: The semiconductor light emitting device A1 is provided with a plurality of LED chips 2 and a conduction supporting member wherein the LED chips 2 are mounted. The conduction supporting member includes first and second leads 1A and 1B, and all of the LED chips 2 are mounted to the first lead 1A. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
