| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and structure for measuring temperature that conducts heat appropriately from an object whose temperature is measured to a temperature sensor at low total manufacturing costs in application to equipment that is manufactured in a small number. SOLUTION: A glass epoxy plate (planar spacer) 4 having a through hole 7 that becomes a gap for arranging a temperature detection IC (temperature sensor) 1 is provided between a printed circuit board (board) 2 for packaging the temperature detection IC (temperature sensor) 1 and the object 3 whose temperature is measured. The printed circuit board (board) 2 is mounted to a condensation curing type silicone (heat transfer material) 10 applied to an opening formed by the object 3 whose temperature is measured and the sidewall surface of the opening of the glass epoxy plate (planar spacer) 4 so that the temperature detection IC (temperature sensor) 1 comes into contact, thus dispensing with molds and heating processes and adhering the heat transfer material to the object whose temperature is measured and the temperature sensor appropriately. COPYRIGHT: (C)2006,JPO&NCIPI
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