发明名称
摘要 <p>PROBLEM TO BE SOLVED: To produce a vehicle for a thick-film paste capable of producing the thick-film paste capable of ensuring good quality without causing defects such as the breakage and a high resistance of a wiring in a heat treated printing film by thermally dissolving an organic polymer in an organic solution while introducing air or oxygen thereinto. SOLUTION: (A) An organic polymer is thermally dissolved in (C) an organic solution while introducing (B) air or oxygen thereinto. Concretely, e.g. (A') a granular ethyl cellulose as the component A and (C') carbitol acetate as the component C are fed at (9/1) weight ratio of the components C'/A' to a heating vessel 1, stirred and mixed with stirring blades 7 and then heated at 120 deg.C with a heating heater 6 while passing the component B from a feed source 8 through a gas flow rate control meter 9 and introducing the component B from a gas introduction port 10 at 10mL/min flow rate thereinto to dissolve the component A' in the component C'. Thereby, the vehicle for a thick-film paste is obtained. Furthermore, the thick-film circuit substrate is produced by using the thick-film paste.</p>
申请公布号 JP3817770(B2) 申请公布日期 2006.09.06
申请号 JP19960060582 申请日期 1996.03.18
申请人 发明人
分类号 H01B13/00;H05K1/09;C09D11/00;C09D11/02;C09D11/033;C09D201/00;H05K3/12 主分类号 H01B13/00
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