发明名称 Method for dynamic alignment of substrates
摘要 A method for calibrating a system generates data indicating the position of a wafer relative to a blade of a wafer transport robot. The method comprises the operations of: mounting the wafer transport robot adjacent to semiconductor manufacturing equipment having a port, the blade being movable by the robot through the port along a transport axis; securing a calibration wafer to a blade at a position centred with respect to the blade, the calibration wafer having a known radius, the calibration wafer having a leading edge during movement for blade carrying the calibration wafer, and a trailing edge during movement; providing a sensor at an unknown location on a port axis that extends in the port transverse to the transport axis, the sensor being in a position to be tripped first by the presence of the leading edge so that the sensor generates a first data item, the sensor being in a position to be tripped second by the absence of the wafer following the trailing edge so that the sensor generates a second data item; causing the robot to move the calibration wafer on the transport axis and through the port past the sensor so that the sensor generates the first and second data items; and using the radius of the calibration wafer and the first and second data items to determine the distance from the transfer axis of the unknown location of the sensor on the port axis.
申请公布号 EP1698955(A1) 申请公布日期 2006.09.06
申请号 EP20060008154 申请日期 2000.11.22
申请人 LAM RESEARCH CORPORATION 发明人 MOORING, BENJAMIN W.;FREUND, CHARLES W.
分类号 B25J9/06;G05B19/408;G05B19/401;G05B19/402;H01L21/00;H01L21/302;H01L21/3065;H01L21/68 主分类号 B25J9/06
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