发明名称 MOLDED MULTI-PART FLOW FIELD STRUCTURE
摘要 A molded multi-part flow field structure includes a molded flow field plate formed of a conductive material comprising a first polymer. A molded frame is disposed around the flow field plate and formed of a non-conductive material comprising a second polymer. The molded flow field plate and frame preferably define a unipolar flow field structure. Manifolds are formed in the molded frame, and a molded gasket arrangement is disposed proximate a periphery of the manifolds. A molded coupling arrangement may be formed to extend from the frame and configured to couple the flow field structure with other unipolar flow field structures to define a continuous web of the unipolar flow field structures.
申请公布号 EP1698013(A2) 申请公布日期 2006.09.06
申请号 EP20040813300 申请日期 2004.12.07
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 FERGUSON, DENNIS E.
分类号 H01M8/02;B28B5/00;H01M2/08;H01M8/24 主分类号 H01M8/02
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