发明名称 |
MOLDED MULTI-PART FLOW FIELD STRUCTURE |
摘要 |
A molded multi-part flow field structure includes a molded flow field plate formed of a conductive material comprising a first polymer. A molded frame is disposed around the flow field plate and formed of a non-conductive material comprising a second polymer. The molded flow field plate and frame preferably define a unipolar flow field structure. Manifolds are formed in the molded frame, and a molded gasket arrangement is disposed proximate a periphery of the manifolds. A molded coupling arrangement may be formed to extend from the frame and configured to couple the flow field structure with other unipolar flow field structures to define a continuous web of the unipolar flow field structures. |
申请公布号 |
EP1698013(A2) |
申请公布日期 |
2006.09.06 |
申请号 |
EP20040813300 |
申请日期 |
2004.12.07 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
FERGUSON, DENNIS E. |
分类号 |
H01M8/02;B28B5/00;H01M2/08;H01M8/24 |
主分类号 |
H01M8/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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