| 摘要 |
A light emission apparatus that can restrict deterioration of resin used for the light emission apparatus, and that has a reasonable structure fit for actual use is provided, in which a light reflective layer is provided to cover the side surfaces of the chips 26 provided in the concave 2 a. According to this, excitation light reflected by the phosphor layer 32 , such as ultraviolet light, is reflected again by the light reflective layer 27 . Therefore, the excitation light will not reach the resin layer 21 , thereby restraining the deterioration of the resin. Moreover, the light reflective layer 27 covers the side surfaces of the chips 26 , thereby efficiently conducting the heat emitted from the chips 26 to the metal substrate 20 via the resin layer 21 . This improves the heat-dissipation efficiency of the chips 26. |
