Die frame apparatus and method of transferring dies therewith

摘要

A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. A ring shaped groove is formed in a first surface of a wafer around a plurality of dies. The wafer is scribed to form a grid of grooves in the first surface of the wafer that separates the plurality of dies. A solidifiable material is applied to the first surface of the wafer to substantially fill the ring shaped groove and the grooves of the grid. The solidifiable material is caused to harden into a ring shaped hardened material in the ring shaped groove and into a grid shaped hardened material in the grooves of the grid. The wafer is thinned so that the grid shaped hardened material removably holds the plurality of dies.