发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
A stacked MCM is manufactured at reduced cost without using expensive apparatus. A first wiring and a second wiring are formed on a surface of a semiconductor chip of a first semiconductor device through an insulation film. A glass substrate having an opening to expose the second wiring is bonded to the surface of the semiconductor chip on which the first wiring and the second wiring are formed. A third wiring is disposed on a back surface and a side surface of the semiconductor chip through an insulation film and connected to the first wiring. And a conductive terminal of another semiconductor device is connected to the second wiring through the opening.
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申请公布号 |
US7102238(B2) |
申请公布日期 |
2006.09.05 |
申请号 |
US20040828556 |
申请日期 |
2004.04.21 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
NOMA TAKASHI;SUZUKI AKIRA;SHINOGI HIROYUKI |
分类号 |
H01L23/48;H01L23/50;H01L21/768;H01L23/31;H01L23/485;H01L23/52;H01L25/065;H01L27/148;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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