Methods and apparatus for forming a cohesive backplane interconnect system

摘要

An assembly couples first and second backplanes together. The first backplane is configured to carry first electrical backplane signals among a first set of circuit boards. The second backplane is configured to carry second electrical backplane signals among a second set of circuit boards. The assembly includes a first switch configured to convey at least some of the first electrical backplane signals between circuit boards of the first set of circuit boards. The assembly further includes a second switch configured to convey at least some of the second electrical backplane signals between circuit boards of the second set of circuit boards. The assembly further includes a fiber optic cable joining the first and second switches together. The first and second switches are configured to exchange fiber optic signals through the fiber optic cable thus forming a cohesive backplane interconnect system between the first and second sets of circuit boards.