| 摘要 |
A system ( 10 ) and method ( 30 ) for precisely depositing a solder compound onto a substrate ( 18 ). The system ( 10 ) generally includes a receiving member ( 20 ) having a rotatable portion ( 21 ) adapted to receive a planar substrate ( 18 ), a horizontal member ( 12 ) for depositing solder balls ( 11 ) on the substrate ( 18 ), and a contact member ( 14 ), located between the receiving member ( 20 ) and horizontal member ( 12 ). The contact member comprises an aligner plate ( 14 ) having a pair of stoppers ( 15 ) protruding therefrom. Advantageously, pivotable portion ( 21 ) of the system ( 10 ) establishes the planarity of the substrate ( 18 ), with respect to the horizontal mount ( 12 ) allowing for the solder balls ( 11 ) to be mounted thereon, preventing the substrate ( 18 ) from being slightly misaligned, warped, and/or tilted.
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