发明名称 Method for forming conductive line of semiconductor device
摘要 A method for conductive line of semiconductor device is disclosed. A cobalt silicide layer is formed on an impurity junction region exposed through a contact hole. The cobalt silicide layer stabilizes a contact resistance so that the contact resistance of the impurity junction region does not vary in subsequent thermal processes.
申请公布号 US7101791(B2) 申请公布日期 2006.09.05
申请号 US20040879133 申请日期 2004.06.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 JIN SUNG GON
分类号 H01L21/44;H01L21/28;H01L21/285;H01L21/3205;H01L21/336;H01L21/4763;H01L21/74;H01L21/768;H01L21/8238 主分类号 H01L21/44
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