| 摘要 |
PURPOSE: A stacked semiconductor package is provided to reduce warpage and minimize the possibility that a solder ball and a ball pad are separated by improving coherence by a reflow underfill adhesive including all solder balls. CONSTITUTION: A substrate(11,21) is prepared. A semiconductor chip(12,22) is located in the center of the substrate. The semiconductor chip is electrically connected to the substrate by a bonding wire(13,23). The semiconductor chip and the wire are molded and protected by an encapsulation material(14,24). The solder ball(15,25) is attached to a surface of the substrate to connect the electrical signal of the semiconductor chip to the outside. The first unit package includes the substrate, the semiconductor chip, the bonding wire, the encapsulation material and the solder ball. The second unit package has the same constitution as the first unit package. The second unit package is stacked on the first unit package wherein reflow underfill adhesive(3) is interposed between the first and second unit packages. |
