| 发明名称 |
INTERCONNECTION DEVICE AND METHOD |
| 摘要 |
AN RF MICROCIRCUIT PACKAGE AND INTERCONNECTION DEVICE IS DISCLOSED WHICH MINIMIZES IMPENDANCE MISMATCH BETWEEN CIRCUIT ELEMENTS. MULTIPLE SIGNAL VIE AND CLOSED PROXIMITY GROUND VIES AS WELL AS TUNED WIRE BONDS ARE DISCLOSED.(FIG 1 & FIG 2) |
| 申请公布号 |
MY125788(A) |
申请公布日期 |
2006.08.30 |
| 申请号 |
MY2000PI06125 |
申请日期 |
2000.12.22 |
| 申请人 |
HEI, INC. |
发明人 |
HUANG, GUANGHUA;CHANDLER, PARKER |
| 分类号 |
H01L23/043;H01L23/12;H01L23/66 |
主分类号 |
H01L23/043 |
| 代理机构 |
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