| 摘要 |
A substrate removal apparatus capable of cutting a plurality of aligned, precision slots in a variety of surfaces, such as concrete, asphalt pavement, and other composite substrates, utilizes high-pressure liquid cutting devices. Slots may be cut in pavement for such applications as dowel bar retrofitting for joint load transfer restoration. An apparatus according to one embodiment includes a support frame, a carriage carried by the support frame, and cutting devices coupled to the carriage. The apparatus is configured so that the carriage is movable along a generally horizontal path of travel and a generally vertical path of travel.
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