发明名称 |
SURFACE ACOUSTIC WAVE DEVICE, PACKAGE FOR THE DEVICE, AND METHOD OF FABRICATING THE DEVICE |
摘要 |
A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, a package housing the surface acoustic wave chip, and electrode patterns provided on a bottom surface of the package. The bottom surface of the package is wider than a top surface of the package. The electrode patterns are away from edges of the bottom surface of the package. |
申请公布号 |
KR100614543(B1) |
申请公布日期 |
2006.08.25 |
申请号 |
KR20040043279 |
申请日期 |
2004.06.12 |
申请人 |
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发明人 |
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分类号 |
H01L23/04;H01L41/08;H03H3/08;H03H9/10;H03H9/25;H03H9/64 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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