| 发明名称 |
REFLOW SYSTEM AND REFLOW METHOD |
| 摘要 |
<p>Disclosed is a reflow system for fixing a mounted component to a printed circuit board. The reflow system comprises a fixed heating unit for sending hot air to the printed circuit board, and a movable heating unit for locally changing the temperature of the hot air sent from the fixed heating unit to the printed circuit board.</p> |
| 申请公布号 |
WO2006087820(A1) |
申请公布日期 |
2006.08.24 |
| 申请号 |
WO2005JP02738 |
申请日期 |
2005.02.21 |
| 申请人 |
FUJITSU LIMITED;IKETAKI, KENJI |
发明人 |
IKETAKI, KENJI |
| 分类号 |
H05K3/34;B23K1/00;B23K1/008 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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