发明名称 SPEAKER FIXING STRUCTURE FOR INTERCOM
摘要 PROBLEM TO BE SOLVED: To ensure excellent call receiving voice quality when the sound pressure level of a voice to be emitted from a speaker is increased, and to sufficiently ensure an area of a substrate on which electronic components and terminals for operating the speaker are mounted and an area of mounting the electronic components. SOLUTION: In arranging the speaker 10 and the substrate 20 on a lower case 1b so that they may be superimposed in this order, a shock absorbing material 30 is arranged on the voice emitting surface side of the speaker to be sandwiched between the substrate and the lower case and fixed. Also, a hole 20a for ensuring sound pressure which is drilled on the substrate is formed so that its diameter may be smaller than the external diameter of the speaker, and a tall electronic component and a terminal 201 are arranged on the lower case being the rear surface side of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006222533(A) 申请公布日期 2006.08.24
申请号 JP20050031760 申请日期 2005.02.08
申请人 AIPHONE CO LTD 发明人 YAMADA MANABU;MIZUTANI YUKITAKA
分类号 H04M1/03;H04M9/00;H04R1/02 主分类号 H04M1/03
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